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Semiconductor Engineering17 m
AI Accelerators Moving Out From Data Centers
Chiplets will be a key enabler for customizing designs at every level, from edge devices to the cloud. AI is a key driver, ...
Semiconductor Engineering37 m
Die-to-die Interconnect Standards In Flux
Two standards — Bunch of Wires (BoW) and UCIe — compete with proprietary designs. Today, the latter predominates, since ...
Semiconductor Engineering34 m
Intent Meets Implementation
They depend on careful coordination between RTL, verification and implementation teams. And here’s where things get tricky. Without a consis­tent way to describe and validate power intent across the ...
Semiconductor Engineering8u
Development Flows For Chiplets
Chiplets offer a huge leap in semiconductor functionality and productivity, just like soft IP did 40 years ago, but a lot has ...
Semiconductor Engineering17u
Floorplanning Method Reducing Thermally-Induced Structural Stress In Chiplet Packages (Penn State, Intel, ASU et al.)
Structural and Thermal Aware Methodology for Placement in 2.5D Integration” was published by researchers at Pennsylvania ...
Semiconductor Engineering18u
Embedded GPU: An Open-Source And Configurable RISC-V GPU Platform for TinyAI Devices (EPFL)
An Open-Source and Configurable RISC-V Graphic Processing Unit for TinyAI Applications” was published by researchers at EPFL.
Semiconductor Engineering18u
Effects Of Hardware Prefetchers For Scientific Application Kernels Running on High-End Processors
A new technical paper titled “Memory Prefetching Evaluation of Scientific Applications on A Modern HPC Arm-based Processor” ...